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  tqp4m0009 high isolation reflective spdt switch preliminary datasheet: rev. b 09-26-13 - 1 of 8 - disclaimer: subject to change without notice ? 2013 triquint www.triquint.com applications ? wlan ? cellular infrastructure ? test and measurement ? smart energy ? uhf/vhf ? lmr ? general purpose broadband wireless 8-pin msop package orderin g information part no. description tqp4m0009 spdt reflective switch TQP4M0009-PCB 0.1 - 5 ghz evaluation board standard t/r size = 2500 pieces on a 7? reel functional block diagram product features ? general purpose ? broadband: 100-5000 mhz ? high isolation: 54 db at 2 ghz ? high input ip3: +57 dbm at 2 ghz ? cmos compatible dual voltage control ? lead free, rohs compliant msop 8 package pin configuration pin no. symbol 1 v2 2 v1 3 rfc 4 n/c 6, 7 gnd 5 rf1 8 rf2 backside paddle rf/dc gnd general description the tqp4m0009 is gaas fet single-pole, double throw (spdt) high isolation reflective switch. the tqp4m0009 may be operated using control signals from 1.8 to 5 volts. the tqp4m0009 has 100-5000 mhz broadband performance the tqp4m0009 is packaged in a rohs-compliant, compact 8-pin msop package. the tqp4m0009 is an ideal choice for wireless infrastructure and test & measurement applications requiring high isolation and high input ip3 it can also be used for any general purpose wireless application where isolation is critical.
tqp4m0009 high isolation reflective spdt switch preliminary datasheet: rev. b 09-26-13 - 2 of 8 - disclaimer: subject to change without notice ? 2013 triquint www.triquint.com absolute maximum ratings parameter rating storage temperature -65 to 150c rf input power , cw, 50 , t = 25c +33 dbm control voltage (v1/v2) +6 v operation of this device out side the parameter ranges given above may cause permanent damage. recommended operating conditions parameter min typ max units v1/v2 high state 1.8 3.3 5.00 v operating temp. range -40 +85 c electrical specifications ar e measured at specified test conditions. specifications are not guaranteed over all recommended operating conditions. electrical specifications test conditions unless otherwise noted: temp.=+25c, 50 system parameter conditions min typ max units operational frequency range 100 5000 mhz control voltage low 0 0.25 v high 1.8 3.3 5.0 v insertion loss 0.1 ? 1.0 ghz 1.0 ? 2.5 ghz 2.5 ? 3.0 ghz 3.0 ? 4.5 ghz 4.5 ? 5.0 ghz 0.5 0.6 0.7 0.9 1.2 db isolation rfc port to rf1 or rf2 0.1 ? 1.0 ghz 1.0 ? 2.5 ghz 2.5 ? 3.0 ghz 3.0 ? 4.5 ghz 4.5 ? 5.0 ghz 55 50 45 38 35 db isolation rf1 to rf2 0.1 ? 1.0 ghz 1.0 ? 2.5 ghz 2.5 ? 3.0 ghz 3.0 ? 4.5 ghz 4.5 ? 5.0 ghz 50 45 40 35 30 db return loss ? rfc port 0.1 ? 1.0 ghz 1.0 ? 2.5 ghz 2.5 ? 3.0 ghz 3.0 ? 4.5 ghz 4.5 ? 5.0 ghz 20 15 13 13 13 db input p1db f = 2 ghz +33 dbm input ip3 f = 0.1 ? 5.0 ghz , pout=+10 dbm/tone, f=1 mhz +50 dbm rise ? / ? fall time 10/90% or 90/10% rf 50 ns on ? / ? off time 50% vctl to 90% rf 50% vctl to 10% rf 170 100 ns control voltage bias current v1 or v2 ? = ? 5 v 15 ua
tqp4m0009 high isolation reflective spdt switch preliminary datasheet: rev. b 09-26-13 - 3 of 8 - disclaimer: subject to change without notice ? 2013 triquint www.triquint.com digital control voltages state bias condition low 0.25 v high 1.8 v switch control truth table control voltages signal path state v1 v2 rfc to rf1 rfc to rf2 low high off (isolation) on (insertion loss) high low on (insertion loss) off (isolation) TQP4M0009-PCB evaluation board j4 j5 j6 c4 c2 c1 u1 c6 c7 notes: 1. j7 to j8 thru line may be used to calibrate pcb losses to device. typical performance ? TQP4M0009-PCB test conditions unless otherwise noted: v1 ? / ? v2 =+5 v, temp=25c, 50 system parameter conditions typical value units frequency 1 2 3 ghz insertion loss (1) rfc port to rf1 or rf2 0.4 0.6 0.8 db rfc port return loss 20 15 13 db isolation rfc port to rf1 or rf2 50 50 45 db rf1 to rf2 50 45 40 db input p1db +33 +33 +33 dbm input ip3 pout= +10 dbm/tone, f=1 mhz +50 +50 +50 dbm notes: 1. insertion loss values reflect de-embedding of eval board rf line losses.
tqp4m0009 high isolation reflective spdt switch preliminary datasheet: rev. b 09-26-13 - 4 of 8 - disclaimer: subject to change without notice ? 2013 triquint www.triquint.com performance plots ? TQP4M0009-PCB test conditions unless otherwise noted: v1 ? / ? v2 =+5 v
tqp4m0009 high isolation reflective spdt switch preliminary datasheet: rev. b 09-26-13 - 5 of 8 - disclaimer: subject to change without notice ? 2013 triquint www.triquint.com -2.5 -2 -1.5 -1 -0.5 0 012345 |s21| (db) frequency (ghz) insertion loss vs. frequency +85c +25c ? 40c rfc to rf1: v1=high, v2=low rfc to rf2: v1=low, v2=high -30 -25 -20 -15 -10 -5 0 012345 |s11| (db) frequency (ghz) rfc return loss vs. frequency +85c +25c ? 40c rfc to rf1: v1=high, v2=low rfc to rf2: v1=low, v2=high -30 -25 -20 -15 -10 -5 0 012345 |s11| (db) frequency (ghz) rf1 ? / ? rf2 return loss vs. frequency +85c +25c ? 40c rf1 to rfc: v1=high, v2=low rf1 to rfc: v1=low, v2=high -80 -70 -60 -50 -40 -30 -20 012345 |s21| (db) frequency (ghz) rfc isolation vs. frequency +85c +25c ? 40c rfc to rf1: v1=low, v2=high rfc to rf2: v1=high, v2=low -70 -60 -50 -40 -30 -20 012345 |s21| (db) frequency (ghz) rf1 ? / ? rf2 isolation vs. frequency +85c +25c ? 40c v1=low, v2=high or, v1=high, v2=low 33 34 35 36 37 38 500 1000 1500 2000 2500 3000 3500 p1db (dbm) frequency (mhz) input p1db vs.frequency pout=+15 dbm / tone 1 mhz tone spacing +85c +25c ? 40c 40 45 50 55 60 65 500 1000 1500 2000 2500 3000 3500 iip3 (dbm) frequency (mhz) input ip3 vs.frequency pout=+10 dbm / tone 1 mhz tone spacing +85c +25c ? 40c pin configuration and description
tqp4m0009 high isolation reflective spdt switch preliminary datasheet: rev. b 09-26-13 - 6 of 8 - disclaimer: subject to change without notice ? 2013 triquint www.triquint.com pin no. symbol description 1 v2 switch state control voltage 2 v1 switch state control voltage 3 rfc antenna port 4 n/c no electrical connection. provide grounded land pads for pcb mounting integrity. 6, 7 gnd ground 5 rf1 rf input/output port 1 8 rf2 rf input/output port 2 backside paddle rf/dc gnd rf/dc ground. use recommended via pattern and ensure good solder attach for best thermal and electrical performance. evaluation board pcb specifications pcb 1112323 material and stack-up 50 ohm line dimensions: width = .021? spacing = .006
tqp4m0009 high isolation reflective spdt switch preliminary datasheet: rev. b 09-26-13 - 7 of 8 - disclaimer: subject to change without notice ? 2013 triquint www.triquint.com mechanical information package marking and dimensions marking: product code ? 009 assembly code - yxx notes: 1. all dimensions are in millim eters. angles are in degrees. 2. dimension and tolerance formats conform to asme y14.4m-1994. 3. the terminal #1 identifier and terminal numbering conform to jesd 95-1 spp-012. pcb mounting pattern notes: 1. all dimensions are in millimeters. angles are in degrees. 2. use 1 oz. copper minimum for top and bottom layer metal. 3. we recommend a 0.35mm (#80/.0135") diameter bit for drilling via holes and a final plated thru diameter of 0.25 mm (0.10?). 4. ensure good package backside paddle solder attach for reliable operation and best electrical performance. bottom view 1.727 [.068] exposed paddle 1.700 [.067] detail "a" .254 [.010] .533.102 [.021.004] gauge plane 0-6 .864.051 [.034.002] op 1; .051[.002 ] op 2; .076[.003 ] .229-.357 [.009-014] seating plane +0.002 -0.001 +0.001 -0.001 .152.051 [.006.002] detail "a" 2.360 [.093] 2.997 [1.18] .650 [0.26] 4.877 [1.92] 2.997 [1.18] 009 yxx
tqp4m0009 high isolation reflective spdt switch preliminary datasheet: rev. b 09-26-13 - 8 of 8 - disclaimer: subject to change without notice ? 2013 triquint www.triquint.com important notice for the latest specifications, additional product information, worldwide sales and distribution locations, and information about triquint: web: www.triquint.com tel: +1.503.615.9000 email: info-sales@triquint.com fax: +1.503.615.8902 for technical questions and application information: email: sjcapplications.engineering@triquint.com product compliance information esd sensitivity ratings caution! esd-sensitive device esd rating: class 1b (rf ports) value: 500 volts to < 1,000 volts esd rating: class 1a (dc lines) value: 250 volts to < 500 volts test: human body model (hbm) standard: jedec standard jesd22-a114 esd rating: class iv value: >1000 v test: charged device model (cdm) standard: jedec standard jesd22-c101 solderability compatible with both lead-free (260c max. reflow temperature) and tin/lead (245c max. reflow temperature) soldering processes. package contact plating: nipdau rohs compliance this part is compliant with eu 2002/95/ec rohs directive (restrictions on t he use of certain hazardous substances in electrical and electronic equipment). this product also has the following attributes: ? lead free ? halogen free (chlorine, bromine) ? antimony free ? tbbp-a (c 15 h 12 br 4 0 2 ) free ? pfos free ? svhc free msl rating msl rating: level 1 test: 260c convection reflow standard: jedec standard ipc/jedec j-std-020 contact information the information contained herein is believed to be reliable. triquint makes no warranties regarding the information contained herein. triquint assumes no responsibility or li ability whatsoever for any of the information contained herein. triquint assume s no responsibility or liability whatsoever for the use of the information contained herein. the information contained herein is provided "as is, where is " and with all faults, and the entire risk associated with such information is entirely with the user. a ll information contained herein is subject to change without notice. customers should obtain and verify the latest relevant info rmation before placing orders fo r triquint products. the information contained herein or any use of such information does not grant, exp licitly or implicitly, to any party any patent rights, licenses, or any other inte llectual property rights, whether with r egard to such information itself o r anything described by such information. triquint products are not warranted or authorized for use as critical components in medical, life-saving, or life- sustaining applications, or other applications where a fa ilure would reasonably be expected to cause severe personal injury or death.


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